PM Modi lays foundation stone for ₹1.25 lakh cr-worth semiconductor facilities; details here

Prime Minister Narendra Modi laid the foundation stone for three semiconductor projects, worth around ₹1.25 lakh crore, via video-conferencing on Wednesday, March 13, an official release stated.

Two of the three facilities are located in Gujarat’s Dholera and Sanand, whereas one is being set up in Assam’s Morigaon.

The projects are in line with the government’s vision to “position India as a global hub for semiconductor design, manufacturing and technology development, and foster the creation of employment opportunities for the nation's youth,” the Prime Minister’s Office (PMO) said.

Details of the 3 semiconductor facilities:

The Semiconductor fabrication facility in Gujarat’s Dholera Special Investment Region (DSIR) is being set up by Tata Electronics Private Limited (TEPL), in a tie-up with Taiwan’s Powerchip Semiconductor Manufacturing Corp. (PSMC). With a total investment of over ₹91,000 crore, this will be the first commercial semiconductor fab in the country.

In Sanand, also in Gujarat, the PM laid the foundation stone for the Outsourced Semiconductor Assembly and Test (OSAT) facility, which is being developed by CG Power and Industrial Solutions along with Renesas Electronics Corp. Japan and Stars Microelectronics, Thailand. The project involves a total investment of about ₹7,500 crore.

The foundation stone for another OSAT facility was laid in Assam’s Morigaon. The project is being led by Tata Electronics Private Limited (TEPL), and involves a total investment of around ₹27,000 crore.

“Through these facilities, the semiconductor ecosystem will be strengthened and will get a firm footing in India,” the PMO said.

These units will also provide employment to “thousands of youth in the semiconductor industry” as well as catalyse employment generation in related sectors like electronics and telecom, it added.